rigid multilayer printed board造句
造句與例句
手機(jī)版
- Specification for flex - rigid multilayer printed boards with through connections
有貫穿連接的剛撓多層印制板規(guī)范 - Rigid multilayer printed board
擾性多層印制板 - System of quality assessment - sectional specification - rigid multilayer printed boards
質(zhì)量評估體系.分規(guī)范.剛性多層印制板 - System of quality assessment - capability detail specification - rigid multilayer printed boards
質(zhì)量評估體系.性能詳細(xì)規(guī)范.剛性多層印制板 - Printed boards - rigid multilayer printed boards with interlayer connections - sectional specification
印制電路板.層間連接剛性印制電路板.分規(guī)范 - Sectional specification - flex - rigid multilayer printed boards with through connections ; german version en 123600 : 1996
分規(guī)范.帶貫通連接的彎曲剛性多層印制電路板 - Printed wiring boards - specification for flex - rigid multilayer printed boards with through connections
印制電路板.第11部分:貫穿連接的撓性-剛性多層印制電路板規(guī)范 - Printed boards ; part 11 : specification for flex - rigid multilayer printed boards with through connections
印制電路板.第11部分:有貫穿連接的彎曲剛性多層印制電路板規(guī)范 - Printed boards - part 4 : rigid multilayer printed boards with interlayer connections - sectional specification
印制電路板.第4部分:有扁導(dǎo)線的硬質(zhì)多層印制電路板分規(guī)范 - System of quality assessment - sectional specification - flex - rigid multilayer printed boards with through - connections
質(zhì)量評估體系.分規(guī)范.直通連接的軟-硬性多層印制板 - It's difficult to see rigid multilayer printed board in a sentence. 用rigid multilayer printed board造句挺難的
- Printed boards . part 4 : rigid multilayer printed boards with interlayer connections . sectional specification
印刷電路板.第4部分:層間連接件的剛性多層印刷電路板.分規(guī)范 - System of quality assessment - capability detail specification - flex - rigid multilayer printed boards with through - connections
質(zhì)量評估體系.性能的詳細(xì)規(guī)范.直通連接的軟-硬性多層印制板 - Printed boards ; part 11 : specification for flex - rigid multilayer printed boards with through connections ; identical with iec 60326 - 11 : 1991
印制電路板.第11部分:帶貫穿連接的剛性彎曲多層印制 - Printed boards - part 4 : rigid multilayer printed boards with interlayer connections ; sectional specification iec 62326 - 4 : 1996 ; german version en 62326 - 4 : 1997
印制電路板.第4部分:層間連接剛性多層印制電路板.分 - Harmonized system of quality assessment for electronic components - sectional specification - flex - rigid multilayer printed boards with through connections
電子元器件質(zhì)量評定協(xié)調(diào)體系.分規(guī)范.柔性-剛性多層連接印制電路板 - Harmonized system of quality assessment for electronic components - capability detail specification : flex - rigid multilayer printed boards with through connections
電子元器件用質(zhì)量評估協(xié)調(diào)體系.性能詳細(xì)規(guī)范:整體連接彎曲剛性多層印刷電路板 - Printed boards - rigid multilayer printed boards with interlayer connections - sectional specification - capability detail specification - performance levels , a , b and c
印制電路板.層間連接剛性印制電路板.分規(guī)范.性能詳細(xì)規(guī)格. a , b和c級性能水平 - Printed boards - part 4 : rigid multilayer printed boards with interlayer connections - sectional specification - section 1 : capability detail specification - performance levels a , b and c
印制板.第4部分:層連接的剛性多層印制板.分規(guī)范.第1節(jié):性能詳細(xì)規(guī)范.性能水平a b和c - Printed boards . part 4 : rigid multilayer printed boards with interlayer connections . sectional specification . section 1 : capability detail specification performance levels a , b and c
印刷電路板.第4部分:層間連接件的剛性多層印刷電路板.第1節(jié):容量詳細(xì)規(guī)范性能等級a b和c - Printed boards - part 4 : rigid multilayer printed boards with interlayer connections ; sectional specification ; section 1 : capability detail specification ; performance levels a , b and c iec 62326 - 4 - 1 : 1996 ; german version en 62326 - 4 - 1 : 1997
印制電路板.第4部分:層間連接剛性多層印制電路板.分
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